| 摘要 |
PROBLEM TO BE SOLVED: To enable miniaturization in a physical quantity sensor, having a structure where the electric wires of a sensor section and the outer periphery are contained in the inside and are sealed on the outer periphery. SOLUTION: The physical quantity sensor comprises a sensor wafer 3, having the sensor section 2 for outputting an electric signal, according to the physical quantity, a cover wafer 4 and a lower cover 5 above and under the sensor wafer 3, and the sensor section 2 is sealed. Groove-like recessed parts 6, deeper than the thickness of the first wires 11 for inputting and outputting the electrical signal of the sensor section 2 are formed on the surface of the sensor wafer 3, and the first wires 11 are formed in the recessed parts 6 near a bonding member 13 of the sensor wafer 3. The recessed parts 6 are backfilled, after arranging packing materials 15 on the first wires 11 near the bonding member 13 of the sensor wafer 3, or on non-conductive protective film 14 disposed so as to cover the first wires 11. The second wires 12, conducting to the first wires 11, are formed on the surface of the sensor wafer 3 and the backfilled recessed parts 6, and are connected to a feedthrough electrode 41 inside the bonding members 13 and 43 of respective wafers 3 and 4. COPYRIGHT: (C)2007,JPO&INPIT
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