发明名称 |
Chip package dielectric sheet for body-biasing |
摘要 |
A chip package includes a thermal interface material disposed between a die backside and a heat sink. A dielectric sheet is also disposed between the die backside and the heat sink. The dielectric sheet diminishes overall heat transfer from the die to the heat sink by a small fraction of total possible heat transfer without the dielectric sheet. A method of operating the chip includes biasing the chip with the dielectric sheet in place.
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申请公布号 |
US2007152325(A1) |
申请公布日期 |
2007.07.05 |
申请号 |
US20050323243 |
申请日期 |
2005.12.30 |
申请人 |
INTEL CORPORATION |
发明人 |
DANI ASHAY A.;PRAKASH ANNA M.;JAYARAMAN SAIKUMAR;PATEL MITESH;WAKHARKAR VIJAY S. |
分类号 |
H01L23/34;H01L21/48 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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