发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 According to the substrate processing method of the invention, a mixed fluid obtained by mixing an organic solvent and a gas is supplied to the surface of the substrate. Thereafter, a resist strip liquid to strip off the resist from the surface of the substrate is supplied to the surface of the substrate.
申请公布号 US2007154636(A1) 申请公布日期 2007.07.05
申请号 US20060565698 申请日期 2006.12.01
申请人 HASHIZUME AKIO 发明人 HASHIZUME AKIO
分类号 B05D3/12;B05B7/06;B05C11/02 主分类号 B05D3/12
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