| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component having a capacitor suitable for materializing a high breakdown voltage, while excelling in the adhesiveness between an lower electrode film and a dielectric film. <P>SOLUTION: The electronic components is provided with a substrate and the capacitor. The capacitor has a lamination structure consisting of an electrode film 11 (lower electrode film) provided on the substrate, an electrode film 12 (upper electrode film) which counters the electrode film 11, and a dielectric film 13 between the electrode films 11 and 12. The electrode film 11 has a multilayer structure including an adhesion metal layer 11c which has an oxide layer 11c' and is joined to the dielectric film 13 at the side of the dielectric film 13. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
