| 摘要 |
PROBLEM TO BE SOLVED: To improve throughput of an application drying processing of a substrate. SOLUTION: A resist application processing unit 24 and two reduced pressure drying units 25 and 26 are continuously installed on a linear conveyance line A. In the resist application processing unit 24, resist liquid is continuously applied to two glass substrates G1 and G2 continuously passing a lower part of a nozzle 80 forward and backward and. The glass substrate G1 where application of resist liquid is terminated at first is roller-conveyed along the conveyance line A, passes through the reduced pressure drying unit 25, and is reduced pressure-dried in the reduced pressure drying unit 26. The glass substrate G2 where application of resist liquid is terminated next is roller-conveyed along the conveyance line A, and is reduced pressure-dried in the reduced pressure drying unit 25. The glass substrate G1 where reduced pressure drying is terminated is conveyed to a heating processing unit on a down stream-side along the conveyance line A. The glass substrate G2 passes through the reduced pressure drying unit 26 and is conveyed to the heating processing unit. COPYRIGHT: (C)2007,JPO&INPIT
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