| 摘要 |
The invention pertains to a combination of a substrate ( 6 ) and a wafer ( 15 ), wherein the substrate ( 6 ) and the wafer ( 15 ) are arranged parallel to one another and bonded together with the aid of an adhesive layer ( 8 ) situated between the substrate ( 6 ) and the wafer ( 15 ), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer ( 8 ) is only applied annularly between the substrate ( 6 ) and the wafer ( 15 ) in the edge region of the wafer ( 15 ).
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