MULTILAYER PRINTED WIRING BOARD

摘要

A multilayer printed wiring board has a mounting section for mounting a semiconductor element such as an IC chip on a surface layer of a build up wiring layer. The pitch of a through hole conductors arranged in regions directly below regions whereupon semiconductor elements such as IC chips are mounted is permitted to be smaller than that of through hole conductors arranged in other regions. Thus, delay of power supply to the transistor of the processor core section of the mounted IC chip is suppressed and malfunctioning is prevented from being easily generated.