发明名称 LAMINATED ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable laminated electronic component capable of effectively preventing a structural defect such as an inter-layer strip phenomenon (delamination) even when a dielectric layer is thinned or multiplexed. SOLUTION: The laminated electronic component comprises an inner layer where internal electrode layers and internal dielectric layers are alternately laminated, and outer layers which are arranged on both end surfaces in the laminated direction of the inner layer and composed of an external dielectric layer. The average grain size of dielectric particles constituting the external dielectric layer is larger than that of the dielectric particles constituting the internal dielectric layer. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007173480(A) 申请公布日期 2007.07.05
申请号 JP20050368559 申请日期 2005.12.21
申请人 TDK CORP 发明人 IGUCHI TOSHIHIRO;HOSONO MASAKAZU;KOJIMA TAKASHI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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