| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a circuit board of which heat dissipation performance is improved, capable of obtaining high heat dissipation effect even for heating having steep temperature rise. SOLUTION: The mounting structure of a printed circuit board 10 includes a mounting surface, a mounting surface opposite thereto, and a rear surface heat dissipating land 15 formed thereon. A general-purposed chip component 13 is fixed to the heat dissipation land 15 with an adhesive 12, and thereafter a thick solder bump 14 that covers the circumference of the general-purposed chip component 13 is formed with local flow. COPYRIGHT: (C)2007,JPO&INPIT
|
