发明名称 PROGRAM FOR CALCULATING CONCENTRATION OF IMPURITY WITHIN PLATING LAYER
摘要 PROBLEM TO BE SOLVED: To provide a program for calculating the concentration of impurity within a plating layer, which may calculate the concentration of the impurity within the plating layer and generate a highly-reliable report for the plating. SOLUTION: The program for calculating the concentration of impurity within the plating layer, comprising the steps of: selecting a required form from a plurality of formes, each part of which are predetermined for plating; selecting a predetermined size data in accordance with each form; calculating a surface area for a component comprising a combination of forms selected by using the predetermined data; calculating also the concentration of the impurity within the plating layer being coated on the component by using the surface area derived by a step of calculating the surface area for the component and each parameter for the component; acquiring each type of parameters to calculate the surface area and the concentration of the impurity; and executing a step of generating a data for printing on a computer without permitting to edit calculated results. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007172367(A) 申请公布日期 2007.07.05
申请号 JP20050370382 申请日期 2005.12.22
申请人 NITTO SEIKO CO LTD 发明人 YAGISAWA MASASHI
分类号 G06F17/50;C25D21/00 主分类号 G06F17/50
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