| 发明名称 |
Substrate polishing with surface pretreatment |
| 摘要 |
A method for processing a surface of a substrate is provided. In one embodiment, the method includes pretreating a conductive layer of the substrate by exposing the substrate to a pretreatment fluid, and planarizing the pre-treated substrate in the system.
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| 申请公布号 |
US2007151866(A1) |
申请公布日期 |
2007.07.05 |
| 申请号 |
US20060326636 |
申请日期 |
2006.01.05 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
WANG ZHIHONG;WANG YOU;JIA RENHE;TSAI STAN D. |
| 分类号 |
B23H9/00;B23H5/06;B23H7/00;C25F7/00 |
主分类号 |
B23H9/00 |
| 代理机构 |
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