| 摘要 |
An array circuit substrate including a plurality of substrate units, a plurality of non-stick test circuits, and a plurality of etching windows is provided. Each of the substrate units has a plurality of wire-bond pads and a plurality of plated wires. One of the plated wires is connected to one of the corresponding wire-bond pads, and at least one of the plated wires is a test wire. The non-stick test circuits are respectively disposed between two adjacent substrate units. Each test wire is connected to a test point through the non-stick test circuits. The etching windows are located on the substrate units. The plated wires are respectively cut by the etching windows except the test wires. Furthermore, the non-stick test circuits are not cut by the etching windows. |
