| 摘要 |
<P>PROBLEM TO BE SOLVED: To surely carry out the ultrasonic bonding of flying leads and substrate pads by securing bondability between the flying leads and the substrate pads when bonding the flying leads to the substrate pads. <P>SOLUTION: In this bonding method of flying leads, the flying leads 18 are aligned with a plurality of substrate pads arranged in parallel, respectively, and then ultrasonic vibration is made to act on the flying leads 18 by a bonding tool 20 to bond the flying leads 18 to the corresponding substrate pads 17. The flying leads 18 are formed wider than the substrate pads 17. In bonding the flying leads 18 to the substrate pads 17, the flying leads 18 are first aligned with the substrate pads 17, and then the flying leads 18 are pressed against the substrate pads 17 by the bonding tool 20. Finally, ultrasonic vibration is made to act on the flying leads 18 to bond the flying leads and the substrate pads. <P>COPYRIGHT: (C)2007,JPO&INPIT |
