| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for a light-emitting element which is superior in heat dissipation, and to provide, a light-emitting device. <P>SOLUTION: The wiring board for a light-emitting element is provided with an insulating substrate 1 made of ceramics; a conductor layer which is formed at least on the surface or in the inside of the insulating substrate 1; a concave 9 which is formed on one main surface 1a of the insulating substrate 1 and houses a part of a light-emitting element 13 provided with a semiconductor light-emitting layer, and which is smaller in depth than the thickness of the light-emitting element 13; and a connection pad 3 which is formed on one main surface 1a of the insulating substrate 1, and is connected with a connection terminal formed on the light-emitting element 13 to be housed in the concave 9. <P>COPYRIGHT: (C)2007,JPO&INPIT |
