| 摘要 |
PROBLEM TO BE SOLVED: To provide a dissipator for cooling a semiconductor element in which stress due to difference in thermal expansion between members can be reduced effectively, the number of components can be decreased, and device configuration can be miniaturized and simplified and to provide related technique. SOLUTION: In the dissipator 13 for cooling a semiconductor element, a plurality of fin members 19 are formed by machining a metal plate substantially like a bellows and bonded to a substrate 17 at the root portion 19b of the bellows. The plurality of fin members 19 have a long planar shape where the bellows is extending along its long width direction D1, and are bonded to the substrate 17 while spaced apart from each other in the short width direction D2 of the planar shape. The substrate 17 is formed of an insulating ceramic material. COPYRIGHT: (C)2007,JPO&INPIT |
