| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper particle or the like used for copper paste, whose treatment is easier compared with copper paste using flake copper powder, with which fine circuit wiring can be formed, and with which an electrically conductive film with low electric resistance can be formed. SOLUTION: The copper particle is obtained by a wet type reduction process, and, in the copper particle, the particle surface is provided with knobby ruggedness. The method for producing a copper particle is characterized in that a reduction process where chlorine ions are contained in a copper ion-containing solution on a fixed level or above, and reduction is caused to obtain a copper particle is performed so as to be divided into two step reduction stages composed of a stage till reduction to copper suboxide and a stage till reduction to a copper particle thereafter. COPYRIGHT: (C)2007,JPO&INPIT
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