| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing technique which can reduce contamination of mechanism inside an exposure device. <P>SOLUTION: A dummy substrate to be used for alignment processing is carried from an exposure unit to a substrate processing device, immediately before or immediately after alignment processing has been carried out for adjusting an exposure position of a pattern image in the exposure unit, corresponding to liquid immersion exposure. In the substrate processing device, the received dummy substrate is cleaned by a cleaning treatment unit and then dried. The dummy substrate, after being cleaned, is again returned from the substrate treatment device to an exposure unit. Since alignment processing can be performed by using a clean dummy substrate in the exposure unit side, contamination of a mechanism inside the exposure unit, such as substrate stage, can be reduced. Furthermore, if the dummy substrate is water-shedding, it is also possible to recover water-shedding quality by cleaning in a substrate processing device side. <P>COPYRIGHT: (C)2007,JPO&INPIT |
