| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicon wafer polishing machine which can overcome degradation in flatness in a final grinding step by improving only a retaining assembly used for the polishing machine as a consumable, without changing the configuration of the wafer polishing machine generally used in the final grinding step. <P>SOLUTION: A disclosed retaining assembly for polishing a silicon wafer comprises a polishing platen which rotates with a polishing pad bonded thereon, a retainer ring which is disposed on the bottom of a polishing head rotating in the same direction and prevents a wafer from being separated during polishing, and a backing film bonded to one side of the retainer ring to support the wafer, wherein the backing film is made of different kinds of material. The backing film in the retaining assembly for polishing a wafer is configured in a reducing type with different dimensions and mechanical/physical properties, so that the flatness of the wafer can be corrected in the final polishing step. <P>COPYRIGHT: (C)2007,JPO&INPIT |
