| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and method which can treat a substrate well according to the details of treatment of the substrate. SOLUTION: The substrate treatment apparatus has a first holding mode wherein a substrate W is supported by a nitrogen gas supplied onto the surface of the substrate, with first support pins F1-F12 abutting against the rear face of the substrate supporting the substrate; a second holding mode wherein the substrate W is supported by a nitrogen gas supplied onto the surface of the substrate, while second support pins S1-S12 abut against the end face of the substrate W when the substrate W is moved horizontally to regulate the movement of the substrate W in the horizontal direction, and at the same time, abut against the rear face of the substrate to support the substrate; and a third holding mode wherein the substrate is supported by a nitrogen gas supplied onto the surface of the substrate, with the first and second support pins F1-F12 and S1-S12 abutting against the rear face of the substrate to support the substrate. The holding mode is selectively switched among these three modes according to the details of treatment of the substrate. COPYRIGHT: (C)2007,JPO&INPIT |
