An electronic component module (27i) is provided with a ceramic substrate having a rear plane (27a) whose outer shape is rectangular, and a plurality of lands (3) arranged on the rear plane (27a) for applying an adhesive material. The lands (3) include outer circumference land rows (4) arranged in lines along each side on the rear plane (27a), excluding corner sections (7). The lands (3) include corner section inner side lands (5), at positions which are shifted inside in a substantially diagonal direction from the corner sections (7) on the rear plane (27a) and are adjacent to the ends closest to the corner sections (7) among the outer circumference land rows (4) arranged in lines along the two sides, having the corner section (7) in between.
