发明名称 PLATING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a technology for enabling a diaphragm to be arranged in a more facilitated manner in a plating tank of a plating apparatus having the diaphragm for separating an object to be plated from an anode. <P>SOLUTION: The plating apparatus is provided with the plating tank comprising an opening on which the object to be plated is placed, a solution-supply tube for supplying a plating solution toward the object to be plated, an anode positioned opposed to the object to be plated and the diaphragm for separating the object to be plated from the anode. The inner wall of the plating tank is provided with a diaphragm-periphery fixing part for fixing a peripheral end of the diaphragm, the solution-supply tube is composed of a dual tube consisting of an inner tube and an outer tube, the inner tube has an inner tube part allowed to pass through a through-hole formed at a center of the diaphragm and a diaphragm through-hole fixing part for fixing the through-hole and the outer tube has an engaging part for fixing the inner tube with the inner tube part accommodated and further has a tank-fixing part to be fixed in the plating tank. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007169773(A) 申请公布日期 2007.07.05
申请号 JP20060025673 申请日期 2006.02.02
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 UCHIUMI YUJI
分类号 C25D17/00;C25D5/08;C25D7/00;C25D7/12;H01L21/288;H05K3/18 主分类号 C25D17/00
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