| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique for dispensing with a trestle elevation mechanism and a turntable elevation mechanism being provided for improving the damage of a wafer and the poor surface treatment of the wafer, when the turntable on which the wafer is placed is rotated for surface-treating the wafer, for accurately positioning the wafer at an appropriate position, and performing each kind of treatment, such as film formation, etching, and cleaning treatment appropriately. <P>SOLUTION: In the guide mechanism for guiding the object 3 to be placed on the table 1, guide members 6a, 6b, 6c in the guide mechanism retreat at the side of both the ends of an upper part 8 and a lower part in the guide members 6a, 6b, 6c and project at the side of the hollow section 7. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
