| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg which can simply be plated to form a conductor layer having excellent adhesive strength, and is useful as an insulating material for flexible circuit boards and the like. SOLUTION: This prepreg is characterized in that a thermosetting resin composition comprising (A) a linear modified polyimide resin obtained by the reaction of a bifunctional hydroxy group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride and (B) one or more thermosetting resins selected from epoxy resins, bismaleimide resins, cyanate ester resins, bisallylnadic imide resins, vinylbenzyl ether resins, benzoxazine resins, and bismaleimide-diamine polymers is impregnated into a sheet-like reinforcing substrate comprising fibers. COPYRIGHT: (C)2007,JPO&INPIT |
