| 摘要 |
PROBLEM TO BE SOLVED: To enable to further reduce a mounting area on a circuit board. SOLUTION: The sensor module is provided with a sensor device A composed of an acceleration sensor element; an IC chip 4 in which a signal processing circuit for processing an output signal from the sensor device A is formed; and a mounting substrate 5 on which the sensor device A and the IC chip 4 are mounted. The mounting substrate 5 is formed into a rectangular box shape opened at one surface, the sensor device A is housed in an internal space 51 of the rectangular box-like mounting substrate 5, the sensor device A is flip-chip bonded to the internal bottom surface 5a side in a such a way that a gap is formed between the internal surface and the side surface of the sensor device A, the IC chip 4 is flip-chip bonded to the external bottom surface 5b side, and terminals 55 for external circuit connection are formed on the one surface side. COPYRIGHT: (C)2007,JPO&INPIT |
