| 摘要 |
A method for forming an improved electrical connection to a die or wafer which does not utilize micro-probes, is physically compatible with ultra-high NA objectives used for low photon emission observation, forms more secure electrical connections, is practical for contacting a die at any position on a full wafer. The method can be used for failure analysis utilizing electrical stimulation of the die yielding optical or thermal output. It can also be used in methods wherein optical stimulation yields electrical output.
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