| 摘要 |
The invention relates to crosslinkable, thermoplastic polyamide molding compounds, the polyamides being selected among a group comprising amorphous or microcrystalline polyamides, copolyamides thereof and the blends thereof, and blends of such polyamides with semicrystalline polyamides. One inventive polyamide molding compound is characterized in that the same contains a crosslinking additive which causes the production of crosslinked molded parts formed from said polyamide molding compound under the effect of high-energy irradiation, said molded parts having a glass transition temperature of >140 °C and a minimum dimensional stability of 90 percent at temperatures of > 180 °C. Said polyamides have a substantially linear structure while the monomers thereof contain no olefinic C=C double bonds. Also disclosed are corresponding crosslinked molded polyamide parts produced from a polyamide molding compound as well as the use of said polyamide molding compound for producing the crosslinked molded polyamide parts. |
