APPARATUS AND METHOD FOR IMPEDANCE MATCHING IN A BACKPLANE SIGNAL CHANNEL

摘要

An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels; a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel; and an impedance matching terminal electrically coupled to the stub and to a ground. A process comprising providing a printed circuit board including a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels, and a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel and being designed to receive a signal from a component attached to the printed circuit board; and coupling an impedance matching terminal to the stub and to a ground.