| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power converter capable of effectively suppressing internal temperature rising. <P>SOLUTION: The power converter comprises a semiconductor module 2 which incorporates a semiconductor element 21, and a cooling pipe 4 stacked and arranged to pinch the semiconductor module 2 from both main surfaces 25. The cooling pipe 4 comprises a pair of shell plates 41, an intermediate plate 42 arranged between the pair of shell plates 41, and an inner fin 43 arranged between the intermediate plate 42 and the shell plate 41, with a coolant channel 44 formed between the intermediate plate 42 and the shell plate 41. The intermediate plate 42 comprises a protrusion 421 which protrudes outside beyond the shell plate 41. <P>COPYRIGHT: (C)2007,JPO&INPIT |
