| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emission package using light emitting diodes with an excellent heat dissipation characteristic. <P>SOLUTION: The light emission package includes the resin sealed light emitting diodes and a heat dissipation member located at the opposite side to light emission sides, the heat dissipation member comprises a composite material composed of a bundle of carbon fibers arranged substantially unidirectionally with a thermal conductivity of 500W/(m×K) or over joined by a high thermal conductive metal with a thermal conductivity of 100W/(m×K) or over, and the bundle of the carbon fibers is arranged so that the direction of the carbon fibers is directed from the inside of the light emission package to the outside. <P>COPYRIGHT: (C)2007,JPO&INPIT |
