| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a structure of mounting semiconductor components without any voids (bubbles) at the elimination section of a resist film. <P>SOLUTION: In the method of mounting the semiconductor components, an extension pattern 3 is extended from a land 2 to the side of one side 6a of a body 6. By injecting the underfill 9 from the side of one side 6a, the underfill 9 starts to be routed along the edge of the elimination section 4a of the resist film 4, and flows into the elimination section 4a via the extension pattern 3 from the injection side of the underfill 9, thus eliminating the voids (bubbles) in the elimination section 4a. <P>COPYRIGHT: (C)2007,JPO&INPIT |
