发明名称 LAMINATE PIEZOELECTRIC ELEMENT, ITS PACKAGING METHOD, AND ULTRASONIC PROBE
摘要 <P>PROBLEM TO BE SOLVED: To obtain an ultrasonic probe of thin diameter by enhancing the mechanical and electrical performance and the reliability of a laminate piezoelectric element. <P>SOLUTION: The ultrasonic probe 11 incorporates an ultrasonic transducer 31 where second laminate structures 47a and 47b formed by laminating insulators 49a, 49b, 50a, 50b and electrodes 51a, 51b alternately are bonded to the side faces 48a, 48b of a first laminate structure 43 composed of piezoelectrics 42a-42c and internal electrodes 41a, 41b. The second laminate structures 47a and 47b are formed such that the insulators 49a, 49b, 50a, 50b and the electrodes 51a, 51b touch the piezoelectrics 42a-42c and the internal electrodes 41a, 41b, respectively, on the side faces 48a, 48b. Surface and back electrodes 44, 45 are extended, respectively, to the end faces 54b, 54a of the electrodes 51b, 51a exposed to a surface opposing the surface of the second laminate structures 47a, and 47b bonded to the side faces 48a, 48b. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007173309(A) 申请公布日期 2007.07.05
申请号 JP20050364968 申请日期 2005.12.19
申请人 FUJIFILM CORP 发明人 HIUGA HIROAKI
分类号 H01L41/083;H01L41/22;H01L41/297;H01L41/313;H01L41/338;H04R17/00 主分类号 H01L41/083
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