| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily and surely inspect the airtightness of an airtight space, in a physical quantity sensor having the airtight space formed of a wafer level package, and to provide its manufacturing method. <P>SOLUTION: A sensor section 2, for outputting an electrical signal according to physical quantity to be measured, is formed in the airtight space R1 formed of the wafer level package by a semiconductor micromachining process. The physical quantity sensor comprises a pressure sensor 3, having an airtight chamber R2 adjacent to the airtight space R1 via a diaphragm 30 and a strain gage for measuring the amount of deformation of the diaphragm 30. The pressure sensor 3 enables inspection of the airtightness of the airtight space R1 that is required for maintaining the characteristics of the sensor section 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
