| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic component packaging system and method therefor in which packaging quality can be ensured by preventing packaging fault resulting from positional error in the height direction of a substrate. <P>SOLUTION: In the electronic component packaging system constituted by coupling a plurality of electronic component packaging devices; height position of a height measuring point set on the upper surface of a substrate is measured by the height measuring instrument of print inspection equipment, and the measurements are outputted as substrate height data. After a substrate is carried into an electronic component mounting device, height is measured again for a specific height measuring point to acquire substrate height correction data. Variation in height position of individual substrates is corrected with high precision by updating parameters for controlling the component mounting operation of a mounting head, based on the substrate height data and the substrate height correction data, thus preventing packaging fault resulting from positional error in the height direction of a substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
