| 摘要 |
PROBLEM TO BE SOLVED: To provide a small multi-chip module capable of coping with a request for an increase in the number of pins provided to a package, and dispensing with an expensive ball mounting device, without increase the external dimensions, and to provide its manufacturing method. SOLUTION: The small multi-chip module 400 attached to a circuit board for establishing electrical connections is equipped with a chip substrate 50 provided with a first front surface and a first rear surface opposite to the first front surface, and where first soldering pads 53 and second soldering pads 54 electrically connected to the first soldering pads 53 have been formed; IC chips 40 mounted on the first rear surface; and an interposer board 60, which is equipped with conductors 65 that are provided between the chip substrate 50 and the circuit board and electrically connected to the circuit board. COPYRIGHT: (C)2007,JPO&INPIT
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