| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of slimming down while having high coplanarity and reliability. SOLUTION: In order to suppress a curvature of a semiconductor package 10 of an overcoat structure, when a thermal expansion coefficient, Young modulus, and thickness of a wiring board 11 areαs, Es, and Hs, respectively, and those of a resin layer 13 beingαr, Er, and Hr, respectively, the value R of (αr×Er×Hr)/(αs×Es×Hs) is configured to be approximately 0.6 or over. By adopting such a configuration, it is possible to effectively reduce the stress exerted on the semiconductor package 10 to improve its coplanarity. COPYRIGHT: (C)2007,JPO&INPIT
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