| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a ceramic substrate has difficulty in processing when the ceramic substrate is used as a heat radiating substrate of an LED. <P>SOLUTION: A heat radiating resin 102 as an insulation layer containing an inorganic filler and a resin compound containing a thermosetting resin, and a lead frame 100 principally containing copper are formed so as to match a concave portion shape of a metal substrate 112 having the concave portion on its one surface, and an LED 108 is mounted on the lead frame 100 portion on the bottom of the concave portion. With this configuration, the heat generated in the LED 108 can spread to the entire light-emitting module via the lead frame 100, and the thickness of the heat radiating resin 102 can be thinned and equalized. Thus, the heat of the lead frame 100 can be efficiently diffused to the metal plate 112. <P>COPYRIGHT: (C)2007,JPO&INPIT |
