| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting method and device of a disc of a brittle material, particularly, a wafer. <P>SOLUTION: This is a cutting method of cutting the disc of the brittle material, particularly, the wafer, along a cutting proposed line using a laser by an introduction of a thermal stress. This method enables the generation of a temperature gradient required for it, by which a compression stress and a stretching stress are produced. First, the disc is cooled at least along the cutting proposed line from its lower surface toward the upper surface, and the upper surface of the disc is processed along the cutting proposed line by a laser beam. Further, the device carrying out the method is also proposed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
