发明名称 Integrated circuits with RAM and ROM fabrication options
摘要 The present invention relates to electronic integrated circuits (ICs) that retain identical functionality with better performance or lower power dissipation under RAM and hard-wire ROM fabrication options, without the need to alter transistor layout within the IC. An integrated circuit (IC) comprising: a plurality of transistors; and a first selectable fabrication option comprised of a user configurable memory circuit; and a second selectable fabrication option comprised of a hard-wired circuit in lieu of said user configurable memory circuit; wherein, the IC functionality and performance is determined by the configuration memory data in the first fabrication option, and wherein the identical configuration is hard-wired in the second fabrication option without altering the location of transistors within the IC. Such a programmable to hard-wire conversion provides a significant IC cost reduction, performance improvement and power dissipation reduction at minimal NRE cost and improved reliability.
申请公布号 US2007152707(A1) 申请公布日期 2007.07.05
申请号 US20070707231 申请日期 2007.02.16
申请人 MADURAWE RAMINDA U 发明人 MADURAWE RAMINDA U.
分类号 H03K19/173;G06F17/50;G11C16/04;H03K19/177 主分类号 H03K19/173
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