发明名称 Thermal Energy Management of Electronic Devices
摘要 The present invention utilizes solid-state components'/devices' electrically-conductive elements as means for transport of thermal-energy via the application of the Thomson Effect through affecting a change in temperature, such as in the electrical power supply leads. Application may be at electrical current characteristics below that required to energize said solid-state components/devices to achieve intended solid-state utility output. The present invention applies Tesla's phase-change conductive/non-conductive, both of an electrical and/or thermal nature, to the present art of solid-state electronics' individual integrated circuit elements, printed wiring boards, insulating layer(s), and pillars for the optimizing of the thermal-energy-management of such. The present invention analyzes three-dimensional thermal volumes of solid-state items and effecting change of temperature via said items' electrical pathway(s) and/or by effecting said pathways by altering the matter-phase of such pathways resulting in change in conductivity/non-conductivity, both of an electrical and/or thermal nature, of said pathways.
申请公布号 US2007152674(A1) 申请公布日期 2007.07.05
申请号 US20060565857 申请日期 2006.12.01
申请人 HUBBELL DAVID A 发明人 HUBBELL DAVID A.
分类号 G01R31/14 主分类号 G01R31/14
代理机构 代理人
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