| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which gives the interface between a mounting pad and a ferrite high strength, and gives high mounting reliability to a semiconductor chip and a chip component mounted on the mounting pad, and to provide a method of manufacturing the same. <P>SOLUTION: The wiring board 1 includes an insulating substrate having a surface layer of a ferrite layer 20, and one or more mounting pads 5 formed on the surface of the ferrite layer 20. The mounting pad 5 contains a bivalent metal oxide at the outer periphery of the pad 5. The mounting pad 5 preferably have a first conductor 51 mainly made of a metal material, and a second conductor 52 containing the metal material and the bivalent metal oxide. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
