| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that connection reliability is reduced substantially derived from the deformation of parts, the generation of a crack or parts destruction causing a subsequent electric shortage, a short-circuit or the like, due to the pressure of a prepreg directly added to the whole upper surface of parts by the heating pressurization at the time of lamination in such a lamination structure that the parts are mounted to the circuit conductor of the upper surface of a core board, the whole upper surfaces of the parts elements are directly covered with the prepreg of insulating resin, and a lid member is laminated in piles in the upper part of this prepreg. <P>SOLUTION: A substrate with built-in parts comprises a core substrate, mounting parts mounted in this core substrate, a prepreg laid on the core substrate which has glass fibers with a storage hole of mounting parts impregnated by synthetic resin, and a conductive metal or a resin base material which blockades the storage hole formed on this prepreg. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
