| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip pickup device capable of picking up a chip at a high velocity as well as a chip pickup method, and a chip peeling device as well as a chip peeling method. SOLUTION: The chip pickup device vacuum-holds and picks up a chip 6 pasted on a sheet 5 by using a takeout nozzle 20. A sheet lifting member 24 is formed from a flexible elastic body, such as rubber, into a sphere, and is set in a recess 22c prepared in an upper contact support surface of a peeling tool 22. The lift-up face of the sheet lifting member 24 is made to contact the underside of the sheet 5 at a right angle, according to a planar state, when the takeout nozzle 20 is in a down state. The lower surface of the sheet 5 is lifted while the lift-up face is deformed into an upward convex curved surface shape when the takeout nozzle 20 rises together with the chip 6. By so doing, the sheet 5 and the chip 6 can be separated from the chip's outer edge side. COPYRIGHT: (C)2007,JPO&INPIT |
