| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component and an electronic device with an electrical short circuit between electrodes of the electronic component and electrode pads effectively prevented even for the downsized and highly densely packaged susbtrate and electronic device. SOLUTION: The substrate 10 for mounting the electronic component comprises a mounting part 12 for mounting the electronic component 20 by brazing, and electrode pads 30 arranged at the mounting part 12 corresponding to each electrode 21 of the electronic component 20. An insulating layer 40 positioning between the adjacent electrode pads 30 at the mounting part 12 is provided, and the layer 40 and a substrate 11 are made of the same material. COPYRIGHT: (C)2007,JPO&INPIT
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