发明名称 STRUCTURE FOR REMOVING RESIN MOLDED ARTICLE AND MOLD DEVICE FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a structure for removing a resin molded article which can improve the filling property of a resin and easily remove the molded article without a waste, and to provide a mold device for molding a resin. SOLUTION: The structure for removing a resin molded article comprises as follows. In a mold for injection molding in which a molten resin in a spool section 42 is led to multiple cavities 38 through a runner portion 44, an ejection pin 50 pushes a solidified resin so as to take out a molded article in the cavities 38, wherein the spool section 42 is a coning shape, and wherein the fore-end 56 of the ejection pin 50 made into the shape of a coning shape is inserted into the spool section 42 when the molten resin is injected at least, thereby a passage section M guiding the melted resin to the runner portion 44 adjoining the cavities 38 is formed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007168384(A) 申请公布日期 2007.07.05
申请号 JP20050372549 申请日期 2005.12.26
申请人 SEIKO EPSON CORP 发明人 ONO YUKI;HIRABAYASHI TATSUKADO
分类号 B29C45/40;B29C45/27 主分类号 B29C45/40
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