发明名称 Complementary metal oxide silicon image sensor and method of fabricating the same
摘要 Disclosed is a method of fabricating a CMOS (Complementary Metal Oxide Silicon) image sensor. The method includes the steps of: forming a device protective layer and a metal interconnection on a substrate formed with a light receiving device; forming an inner micro-lens on the metal interconnection; coating an interlayer dielectric layer on the inner micro-lens and then forming a color filter; and forming an outer micro-lens including a planarization layer and photoresist on the color filter. The inner micro-lens is formed by depositing the outer layer on dome-shaped photoresist. The curvature radius of the inner micro-lens is precisely and uniformly maintained and the inner micro-lens is easily formed while improving the light efficiency. Since the fabrication process for the CMOS image sensor is simplified, the product yield is improved and the manufacturing cost is reduced.
申请公布号 US2007152246(A1) 申请公布日期 2007.07.05
申请号 US20060646644 申请日期 2006.12.27
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 IM KI SIK
分类号 H01L31/062;H01L21/00 主分类号 H01L31/062
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