| 摘要 |
Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still other example embodiments of the present invention, there may be a tin-bismuth (Sn-Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold (Au) bumps, a substrate having metal wirings connected to the gold (Au) bumps, and a junction including a tin-bismuth (Sn-Bi) family alloy solder interposed between and connecting the gold (Au) bump and the metal wiring. The formation of a relatively large amount of AuSn<SUB>4 </SUB>intermetallic compound may be inhibited in the junction because gold (Au) may not easily diffuse into a tin-bismuth (Sn-Bi) family alloy solder of a liquid state during a reflow process for connecting the semiconductor chip and substrate. Therefore, most of the junction may be retained as the tin-bismuth (Sn-Bi) family alloy solder. |
