| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which, by virtue of anchoring of a lead wire to the lower surface of a support substrate, that is, a surface facing a package, can realize intimate contact of the lead wire to a base substrate without leadforming, can eliminate the need to conduct leadforming, and, through the receipt of an Au splash on the support substrate on the upper surface of the lead wire, can prevent the deposition of the Au splash onto the lead wire to prevent shortcircuiting between the lead wires. <P>SOLUTION: The piezoelectric device comprises a piezoelectric vibrating piece, a lead wire one end of which is connected to the piezoelectric vibrating piece for holding the piezoelectric vibrating piece, and a support substrate for supporting the lead wire. The lead wire in its part near the other end is fixed to the support substrate in its side remote from the vibrating piece. <P>COPYRIGHT: (C)2007,JPO&INPIT |
