| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein tapes adhere locally and cannot be re-taped appropriately. SOLUTION: In a re-taping process, an adhesive sheet S is adhered to the backside of a wafer W in which a background sheet B is adhered to the surface, and the background sheet is peeled. The method comprises a step of fixing the periphery to a background frame F1, and placing the non-adhesive surface side of the background sheet in which the surface side of a wafer is adhered to the side of an adhesive surface on a table 12 having nearly the same plane size as the wafer; a step of arranging a buffering 18 whose inner diameter has nearly the same size as the outer diameter of the wafer at the periphery of the wafer; a step of sticking the side of the adhesive surface of the adhesive sheet in which the periphery is fixed to an expand frame F2 to the backside of the wafer; a step of separating the table from the background sheet; and a step of peeling the background sheet from the surface of the wafer. COPYRIGHT: (C)2007,JPO&INPIT |
