| 摘要 |
PROBLEM TO BE SOLVED: To further reduce a mounting area on a circuit board, and decrease stress transmitted from a mounting substrate or the circuit board to a sensor device. SOLUTION: The sensor module is provided with a sensor device A composed of an acceleration sensor element, and a mounting substrate 5 on which the sensor element A is flip-chip bonded. The sensor device A has a plurality of external connection electrodes 25 on one surface side, and the mounting substrate 5 has a plurality of sensor connection electrodes 53 to which the external connection electrodes 25 are electrically connected. The sensor device A is bonded to the mounting substrate 5 via a plurality of bumps 9a, 9b superimposed in the thickness direction of the mounting substrate 5 for each combination of the external connection electrodes 25 and the sensor connection electrodes 53 for which a connection relation is defined. COPYRIGHT: (C)2007,JPO&INPIT
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