| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for mounting semiconductor device for accurately positioning semiconductor devices and reducing manufacturing cost. SOLUTION: A ceramic layer 7 for polishing process is formed without inclusion of a pad 5 to a bottom surface 31a of the ceramic layer 31 of the lowest layer of the package 3 holding therein a solid-state imaging device 21. The reference flat surface 71 is formed with more intrusion in the thickness direction of the package 3 than the pad 5 by polishing the front surface of the ceramic layer 7 for polishing process. COPYRIGHT: (C)2007,JPO&INPIT
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